The modular Open Frame Test & Development system can be used in VME / 64x- and VPX-based embedded applications. The development system with the rugged modular aluminum construction for 3U boards can support backplanes up to 10 slots at 0.8 or 1.0 inch pitch.
The platform supports any mix of 3U convection or conduction cooled boards on front and rear. The chassis allows board- and system-developers the access to all sides of the boards and the backplane. For efficient cooling the chassis includes 4x 120 CFM high performance fans placed below the card cage. The chassis is black powder coated and includes a rear AC power entry module with power switch, fuses and GND stud.
The unit includes a modular power supply system and offers a wide range of power options. As an option chassis side plates can be mounted to meet EMC requirements. The platform also offers RTM (rear transmission module) support.