DEVELOPMENT CHASSIS

The modular open frame Test & Development system solution can be used in VME / 64x, CPCI and VPX based embedded applications.The development system with the ruggedmodular aluminum construction for 3U and 6U boards can support backplanes up to 10 slots at 0.8 or 8 slots at 1.0 inch pitch. The platform supports any mix of 3U o 6U convection or conduction cooled boards The chassis allows board and system developers the access to all sides of the boards and the backplane. For efficient cooling the chassis includes 4 x120 CFM high performance fans. The fans are driven by a fan controller, providing optimum cooling with minimum noise levels for office and lab environments.

Description

Depth / Width / Height

80 mm / 160 mm / 3, 6 U

Surface

Card cage: alodined Bottom plate and cover aare powder coated

Standards

“Electrical Safety: according EN 60950 EMC-LEVEL: EN 55022, Class B

Protection class: 1

Overvoltage category: 2

IP Protection class: IP 20”

Rear-I/O

Stecktiefe: 80 mm

Characteristics

Weitere Größen auf Anfrage individuell gestaltbar